Together with Prof. Hoc Khiem Trieu (TUHH)  and Prof. Wolfgang Hansen (CHyN, UHH) we successfully participated at the BMBF Call “Forschungslabore Mikroelektronik Deutschland (ForLab)”.

The delivery of two E-Beam Raith Voyager-AddOns and a new EVG wafer bonder are already scheduled for May. Our new III-V-ICP-RIE by SENTECH is going to be installed before summer.

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